Engineering publications brought to you by Mark Allen

Embedded Systems

NEXCOM Announces Rugged, Sunlight-Readable Panel PC for Semi-Outdoor Interactive Applications

Breaking Boundaries: Innovations in Bluetooth and Wi-Fi Technologies

NEXCOM launches TCA 6710 1U rackmount COM-HPC module

Kontron to unveil new Control Panel product line

congatec presents first stage of its aReady strategy

IAR and NexCOBOT announce robot development collaboration

RDS introduces 4K OLED display featuring strong optical performance

Farnell strengthens industrial SBC line card with Advantech products

DVCon Europe 2024 launches call for Papers, Tutorials and Panels

TTTech Auto and BlackBerry QNX to tackle future SDV complexity

ADI and BMW to provide 10Mb ethernet for automotive, enabling software-defined vehicles

SEGGER’s J-Link debug probes now support Renesas RZ/V2H MPU