Engineering publications brought to you by Mark Allen

Internet of Things

Dracula Technologies unveils enhanced LAYER technology with 15% boost to power efficiency

Ceva and Sharp collaborate on "Beyond 5G" IoT terminals

Demanding Data

Renesas debuts ultra-low-power RA4L1 MCUs targeting IoT sensing and HMI applications

AccelerComm unveils latest generation of 5G NR NTN physical layer solutions

Capacitors get really ‘super’

A recipe for success

congatec launches aReady.IOT

Mouser stocking Alif Semiconductor’s Ensemble MCUs for IoT, ML and AI applications

The freedom to communicate

Silicon Labs targets ultra-low power Bluetooth connectivity with latest SoCs

Multi-band GPS/GNSS antennas for high positioning accuracy