Engineering publications brought to you by Mark Allen

Electronics

SemiQ unveils QSiC 1200 V SOT-227 SiC modules

RanLOS and Anritsu present 5G vehicle OTA test solution

Chair of UK SLG issues warning to Government over UK chip industry

xMEMS announces sound reproduction breakthrough with latest speaker

ReDriver from Diodes supports MIPI D-PHY 1.2 protocols

Change is on the horizon

A new design flow

McLaren Applied and Blu Wireless develop ultra high-speed telemetry for motorsports

Infineon extends line of radiation-hardened asynchronous static RAMs

Siemens works with Arm and AWS to bring PAVE360 to the cloud

Arm MCU conference by Hitex

Nordic unveils first silicon-to-cloud locationing solution using Wi-Fi, cellular IoT, and GNSS