Engineering publications brought to you by Mark Allen

Electronics

Industry’s lowest power MEMS accelerometer unveiled

Integrated prototyping solution to speed SoC development

Report says EC should invest in 450mm shared fab

Spatial Audio products from Texas Instruments

PICMG ratifies COM Express mini standard

Second generation bus converter range launched

NXP LPC1100XL

‘BLOB’ – Ground Breaking Plastic Enclosures from OKW

Synchronous buck converter offers 90% efficiency

ST tapes out 20nm test chip using Cadence design tools

Microsemi reacts to ProASIC3 fpga 'backdoor' claim

Xilinx ships ‘world’s first heterogeneous 3d fpga’