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Electronics
Packing a punch
Neil Tyler
Interviews
28 Apr 2023
Infineon introduces the HybridPACK Drive G2 power module
Product Launches
28 Apr 2023
Top 10 IC design houses see revenues drop almost 10 per cent in Q4 2022
Neil Tyler
News
28 Apr 2023
Transphorm introduces new SuperGaN FETs in Standard PQFN packages
Neil Tyler
News
28 Apr 2023
Lattice extends low power FPGA portfolio with the MachXO5T-NX family
Neil Tyler
News
28 Apr 2023
Sony performance-enhanced camera block now commercially available
Neil Tyler
Product Launches
27 Apr 2023
300W buck-boost non-isolated DC-DC converters have wide range input and outputs
Neil Tyler
Product Launches
27 Apr 2023
Synopsys, TSMC and Ansys to collaborate on advanced multi-die systems
Neil Tyler
News
27 Apr 2023
Q5d unveils robot for automating wiring harness manufacturing
Neil Tyler
News
27 Apr 2023
TTTech Auto launches ECU to future-proof automotive E/E architectures
Neil Tyler
News
27 Apr 2023
Cadence and TSMC look to accelerate radar, 5G and wireless Innovation
Neil Tyler
News
27 Apr 2023
Cadence accelerates adoption of TSMC N3E and N2 process technologies
Neil Tyler
News
26 Apr 2023
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