Engineering publications brought to you by Mark Allen

Electronics

Pasternack expands options for LMR and Low-PIM cable assemblies

Photonics specialist Oriole Networks raises additional $22m

Spin-off Brailsports builds AI platform to optimise sports training

Microchip’s RTG4 FPGAs achieve highest space qualification

eMemory and Siemens offer ‘groundbreaking’ SRAM repair toolset

CEA-Leti launches OpenTRNG project targeting industry and academic researchers

Samsung develops 24Gb GDDR7 DRAM for next-generation AI computing

High-temp FPC/FFC connector designed for automotive applications

Alif Semiconductor to support ExecuTorch framework on endpoint-AI applications

Micron launches ultra-fast clock driver DDR5 memory portfolio

Tria Technologies launches COM Express Type 6 Carrier Board

Outlook 2025: Embracing the chiplet journey