Engineering publications brought to you by Mark Allen

Artificial Intelligence

Fraunhofer IPMS presents Edge AI ready RISC V IP core

Weebit scaling down its ReRAM technology to 22nm

Ambarella and Helm.ai announce ADAS software integration

Next-generation thermal edge AI solutions

New process to help tech firms develop safer AI

Kontron COM-HPC Server module targets high-end edge computing

Ranovus and GlobalFoundries in co-packaged optics deal

OpenFive and EdgeCortix announce AI Accelerator SoC collaboration

MicroAI Factory extends edge-native AI into manufacturing

Analog Devices to invest €100mn in European operations with ADI Catalyst launch

Graphcore unveils first 3D Wafer-on-Wafer processor

Major advance for co-packaged optics