Engineering publications brought to you by Mark Allen

Artificial Intelligence

Achronix and BigCat Wireless collaborate to 'revolutionise' 5G/6G wireless applications

Siemens unveils next generation AI-enhanced Electronic Systems Design software

TI MCUs advance system efficiency, safety and sustainability

TSMC to suspend production of AI chips for China

First BLE and Matter wireless MCU to feature neural co-processor for AI/ML workloads

Web-based tool accelerates AIoT projects with smart sensors

Tenstorrent expands deployment of Arteris’ Network-on-Chip IP

Renesas unveils RA8 entry-line MCU groups

AI as game-changer

Ambiq expands support for the Zephyr RTOS

Siemens and CELUS collaborate to offer AI-powered PCB design

The 10 top strategic technology trends for 2025, according to Gartner