Engineering publications brought to you by Mark Allen

Audio Technology

Cadence Tensilica HiFi DSP supports Dolby Atmos for cars

Dirac joins with BlackBerry QNX to improve in-car audio experience

CEVA joins Intel Pathfinder for RISC-V programme

POLYN Technology signs first customer for NASP Tiny AI chips

Luxshare-ICT selects USound as strategic MEMS loudspeaker supplier

Hahn-Schickard and Bosch Sensortec to develop acoustic microsystems

CEVA introduces Voice User Interface Solution for TI SimpleLink MCUs

Infineon`s latest audio amplifiers feature MERUS technology

POLYN Technology and Edge Impulse look to advance Tiny AI products

MEMS microphones for active noise cancelling applications

GaN Systems releases Class D Audio boards and solutions

Infineon working with Cerence to enable ‘the hearing car’