Engineering publications brought to you by Mark Allen

Board Level Design

Harwin offers downloadable CAD models

Parker offers new gap filler pad with high thermal conductivity

MIKROE’s IrDA 4 Click provides solution for sending and receiving IR serial data

Hirose releases multi-RF board-to-board connector

Renesas selects Altium to unify company-wide PCB development

Cards carry the full weight of AI innovation

Arduino Uno scales performance with new 32-Bit versions

Mouser adds Security, IoT, and Low Power Wireless to Dev Kit line-up

Siemens brings real-time supply chain intelligence to its Xcelerator portfolio

Speck Demo kit speeds up deployment of event-based neuromorphic vision applications

Global survey results from Molex’s ‘State of Power’ report

Parker releases high-flow thermal gel for high-volume applications