Engineering publications brought to you by Mark Allen

Embedded Systems

Diodes unveils 10W stereo Class-D audio power amplifier with SSM and NCPL

Cliff extend range of interconnect options available in industry standard 24mm diameter XLR panel cut-out

Connect, share and inspire at CDNLive EMEA 2018 Cadence User Conference

Custom silicon microparticles dynamically reconfigure on demand

One-dimensional material packs a powerful punch for next generation electronics

A surprising new superconductor

Ekioh launches world’s first multithreaded embedded browser

Spin Transfer Technologies PSC structure positions MRAM as the leading memory for mobile, datacentres and AI

Cadence prototypes first IP interface in silicon for preliminary version of DDR5 standard being developed in JEDEC

TI expands lead among last year’s top analogue suppliers

58VIN, 4A, low EMI, EN55022 B compliant µModule regulator

Power Integrations’ SCALE gate drivers available with conformal coating