Engineering publications brought to you by Mark Allen

Research Design

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Samsung/Arm collaboration drives software research in communication technologies

On-chip flow cytometer delivers scalable on-chip detection of human white blood cells

Imec’s NanoIC pilot line to receive investment of €2.5bn

Glasgow University wins grant for new semiconductor research facility

NEO Semiconductor reveals floating body cell mechanism for 3D X-DRAM

SiPearl chooses Italy to open its third international subsidiary

sureCore successfully tape-outs cryogenic IP demonstrator

Semiwise and University of Michigan to tackle cryogenic control electronics technology

CEA-Leti to coordinate EU 6G projects

Blu Wireless selected to lead cutting-edge wireless backhaul project

Intel builds world’s largest neuromorphic system