Engineering publications brought to you by Mark Allen

Semiconductors

Manufacturers continue to push op amp precision and performance

XMOS ships first xCore200

Next generation PMBus digital controller targets high-performance computing

Tool flow provides efficient chip/package/PCB codesign

Cadence, ARM sign 'broad IP interoperability agreement'

Heterogeneous computing 'one step closer', says Foundation

Latest POL module series looks to address power challenge of advanced ICs

Fully encapsulated 50A digital power module from Intersil

Cypress, Spansion merger completes ahead of schedule

Silicon Labs and ARM working to reduce IoT power consumption

SoC design package improves power, performance, area 'by up to 20%'

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