Engineering publications brought to you by Mark Allen

Semiconductors

USC’s MOSIS and SkyWater deliver silicon IC design and manufacturing service

ROHM develops ultra-low-power on-device learning Edge AI chip

Imperas and Andes collaborate to support RISC-V innovations

POLYN Technology signs first customer for NASP Tiny AI chips

Up-front processing

Worldwide semiconductor revenue growth to decline in 2023

Cortus launches LOTUS family with two new RISC-V MCUs

RRAM technology to be introduced into automotive AURIX product family

Mouser stocking Texas Instruments’ DAC63202 precision DAC

Microcontrollers learn to embrace neural networks

SECORA Pay Bio to bring biometric payment cards to a new level

Infineon achieves ISO/SAE 21434 process certification