Engineering publications brought to you by Mark Allen

CPUs

CEVA unveils Bluetooth Dual Mode 5.3 SIG qualified platform

Magnachip develops next-generation OLED DDIC for automotive displays

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Meeting the AI/ML design challenge

CEVA unveils NeuPro-M heterogeneous processor architecture

Infineon unveils AURIX TC4x family of 28nm microcontrollers

In-Circuit Emulator provides feature-rich programming and debugging

ASPEED and CEVA collaborate to improve voice on Cupola360 SoCs

EIC Accelerator programme awards funding to SiPearl

MIKROE adds Waveform 4 peripheral development board

MediaTek launches Dimensity 9000 flagship chip

Renesas develops write technologies for embedded STT-MRAM

Wireless power supply chipset