Engineering publications brought to you by Mark Allen

Semiconductors

Winbond and Ambiq collaborate on Intelligent IoT and wearables

Lattice looks to simplify deployment of AI/ML models on Edge devices

Osram and Infineon bring NFC programming to lighting

PAN1781 Bluetooth 5 Low Energy module

Cadence collaboration with Arm enables tape-out of next-generation mobile designs

Celeno launches chip that combines Wi-Fi, Bluetooth, and Doppler Radar

Third-generation 112G-LR SerDes IP

Farnell stocks OrangeCrab FPGA development board

GUC announces GLink-3D Die-on-Die interface IP

IAR Embedded Workbench supports all NXP i.MX RT crossover MCUs

Analog Devices unveils high-speed DAQ µModule

Cadence introduces Spectre FX FastSPICE simulator