Engineering publications brought to you by Mark Allen

Semiconductors

Marvell unveils dual 400GbE PHY with 100G serial I/Os and MACsec security

TI's stackable DC/DC buck converter targets communications, enterprise and industrial applications

The AIoT 'Big Bang'

Xilinx announces Versal Premium adaptable platform for network and cloud acceleration

Ambiq Micro’s Apollo3 Blue family to feature CEVA's Bluetooth LE IP

Renesas expands RF beamforming portfolio

Infineon collaborates with Qualcomm to enable 3D authentication

AI chipmaker Hailo raises $60m

FTDI launches latest series of multi-channel USB interface ICs

Silicon Labs announces SoC IoT security

New DSP architecture unveiled by CEVA

TASKING expands strategic Infineon partnership