Engineering publications brought to you by Mark Allen

Semiconductors

Industry’s first visually lossless image compression for GPUs

Toshiba announces Bluetooth 5 IC for automotive applications

Connected-car automotive MCU from ST

Bringing AI to the edge

Cypress expands collaboration with Arm to deliver IoT platform with secure device management

Cadence unveils first silicon-proven, long-reach 7nm 112G SerDes IP

4G/5G summit: Qualcomm Quick Charge technology

Yokogawa launches next generation mixed signal oscilloscope

RS Components bolsters educational support with new tools to inspire young engineering talent

Qualcomm extends Wi-Fi experiences with 60GHz 802.11ay solutions

Socionext develops first HDMI 2.1 compatible video processing chips

Low-power 1.8V temperature sensor family