Engineering publications brought to you by Mark Allen

Semiconductors

Tool flow provides efficient chip/package/PCB codesign

Cadence, ARM sign 'broad IP interoperability agreement'

Heterogeneous computing 'one step closer', says Foundation

Latest POL module series looks to address power challenge of advanced ICs

Fully encapsulated 50A digital power module from Intersil

Cypress, Spansion merger completes ahead of schedule

Silicon Labs and ARM working to reduce IoT power consumption

SoC design package improves power, performance, area 'by up to 20%'

Meeting the performance, power and intelligence needs of advanced applications

Some announcements from the recent embedded world exhibition, including Freescale's launch of the KV5x MCU family

Intel launches Xeon based SoC, targets microserver designs

Intersil unveils synchronous buck regulator for FPGAs and MCUs