Engineering publications brought to you by Mark Allen

Electronics

Rapidus and Tenstorrent to develop AI edge devices based on 2nm logic

Green Mountain Semiconductor develops ‘innovative’ AI processor

Würth Elektronik launches HyPerStripes research project

TTI Europe shipping TE Connectivity’s high-voltage connectors for E-mobility applications

onsemi opens systems application lab for electric vehicles in Europe

Infineon extends CoolSiC portfolio with industry-standard package

QuickLogic unveils enhanced Aurora FPGA/eFPGA user tools

Cadence and Autodesk collaborate on smart product design

Secure-IC’s Securyzr technology integrated into MediaTek's Dimensity 9300

SIGLENT releases new flagship SDS7000A oscilloscope

Toshiba launches first 30V N-Channel Common-Drain MOSFET

Synopsys.ai Copilot to accelerate chip design