Engineering publications brought to you by Mark Allen

Electronics

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers

Chips all round

Panmnesia presents enhanced AI vector search system

Quantum-resilient cybersecurity memory module

OMNIVISION extends global shutter sensors portfolio for In-Cabin applications

AONDevices unveils low-latency, customisable edge AI speech enhancement

Vitesco Technologies and ROHM sign long-term SiC supply partnership

Achronix unveils 400 GbE and PCIe Gen 5.0 for SmartNICs

Alphawave Semi expands collaboration with Samsung, adds 3nm connectivity IP

Global 300mm fab equipment spending to reach $119bn in 2026

Infineon introduces ISOFACE portfolio of digital isolators

SEGGER adds STOP technology to Embedded Studio for ARM