Engineering publications brought to you by Mark Allen

Electronics

AAEON signs Edge Impulse partnership agreement to grow edge AI market share

Qualcomm and Sequans reach agreement on sale of 4G IoT technology

Hirose adds low profile version to One Action FPC Connector family

OMNIVISION introduces small-format 50-megapixel image sensor

Resilient connectors ready for duty

Report says that promise of AI relies on scaling security as edge AI booms

Nexperia expands power device portfolio with new ideal diodes

Fairview Microwave unveils Wi-Fi 6e/7 omni and flat-panel antennas

dSPACE develops simulation solutions with CIM Database Cloud

More than half of connected devices will be haptic enabled by 2028

Renesas launches ultra compact sensor module for smart air quality monitoring

indie Semiconductor unveils Qi2 MPP-compliant wireless charging solution