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Agnisys announces safety qualification for software products and design flow

Cadence targets multiphysics system simulation with Fidelity CFD

Volvo Cars Tech Fund invests in StoreDot

Out of touch: Is the touchscreen undermining the user experience?

Winbond and Infineon collaborate to double bandwidth for IoT applications with HYPERRAM 3.0

Infineon unveils space-qualified F-RAM for extreme environments

Pulsonix PCB Design unveils new capabilities in Version 12.0

Turning to aged components amidst supply chain disruption

Virtual development environment for fast automotive application software development

Consortium to develop photonic quantum computer

Britons embrace 5G, but the old-fashioned phone call makes a comeback

EBV Elektronik signs distribution agreement with SG Micro