Engineering publications brought to you by Mark Allen

Consumer

Reference design for 3D spatial audio in headsets and TWS earbuds

ST enhances dual-interface NFC tags

E-Mobility power solution

Renesas extends emWin license to include all RA MCUs

ADI power management IC charges wearables and hearables faster

ST unveils 70W high-power chipsets

Time-of-Flight 3D camera comes with integrated IRBP filter

ST develops Time-of-Flight 8x8 multi-zone ranging sensor

MediaTek's Kompanio 900T targets light weight computing devices

Toshiba expands the TXZ+TM family for high-speed data processing

200W digital-power solution for LED televisions

Stackpole increases power rating for Nichrome chip resistor