Engineering publications brought to you by Mark Allen

Consumer

Apple debuts ‘Apple Intelligence’

TI unveils first GaN IPM to enable smaller, more energy-efficient high-voltage motors

How Android is shaping the next generation of POS terminals

Intelligent integrated sensor for presence detection, facial recognition and always-on

Worldwide smartphone shipments to recover in 2024

MediaTek’s Dimensity 7300 chips target high-tech smartphones and foldables

Arm unveils CSS for Client initiative

GaN System-in-Package targets consumer device charging

AiM Future brings GenAI applications to consumer devices

Fake News

SK hynix develops next-generation Mobile NAND solution ZUFS 4.0

MediaTek unveils Dimensity 9300+ SoC speeding up generative AI processing at the edge