Engineering publications brought to you by Mark Allen

Electronics

Rutronik and MediaTek to bring IoT solutions to device makers in Europe and Israel

China announces chip material export curbs

Early-stage antenna design for IoT and 5G with integrated electromagnetics

Nordic Semi's nRF7002 Wi-Fi 6 companion IC now available from Mouser

Farnell signs global distribution agreement with Seeed Studio

MIKROE’s IrDA 4 Click provides solution for sending and receiving IR serial data

Harwin enters into distribution agreement with TME

Vector now supports automotive ethernet interfaces for 10BASE-T1S

Lightelligence unveils first optical network-on-chip processor

Seoul Robotics introduces QuickConnect

Government urged to do more to support the whole semiconductor ecosystem

Imec and ASML sign agreement to support chip research and sustainable innovation