Engineering publications brought to you by Mark Allen

Electronics

Finnish consortium participating in Sustronics e-waste and materials project

KYOCERA Fineceramics Europe doubles its production capacity in Germany

Linux announces plans to form High Performance Software Foundation

Tektronix introduces Open-Source Python-native driver package for T&M instrumentation

IQM to advance future hybrid quantum applications with NVIDIA

Synopsys expands ARC processor IP portfolio with new RISC-V family

Nexperia and Mitsubishi Electric to jointly develop discrete SiC MOSFETs

6G-SANDBOX project signs collaborative 6G research agreement with ITRI

The ‘Refurbished Revolution’ gathers pace

EPI announces the successful bring-up of the EPAC1.5 acceleration chip

Photonic unveils new quantum architecture

NeuReality to launch NR1 AI inference solution