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Farnell signs global distribution agreement with Seeed Studio

Dolphin Design unveils IP for sound classification cutting down energy by 99%

MIKROE’s IrDA 4 Click provides solution for sending and receiving IR serial data

Harwin enters into distribution agreement with TME

Vector now supports automotive ethernet interfaces for 10BASE-T1S

Lightelligence unveils first optical network-on-chip processor

Melexis motor driver boosts new functions for EVs

Seoul Robotics introduces QuickConnect

Government urged to do more to support the whole semiconductor ecosystem

Infineon expands XENSIV MEMS microphone portfolio

Building the business case for satellite IoT

Imec and ASML sign agreement to support chip research and sustainable innovation