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First silicon-proven 3nm 24 Gbps UCIe subsystem validated

BT’s recycling deal for surplus copper cables turns a profit

LEM sensor delivers accurate SOC estimation across all EV technologies

MIPI releases A-PHY v2.0 doubling maximum data rate of automotive SerDes interface

Sony Semiconductor Solutions and Raspberry Pi launch Raspberry Pi AI Camera

AMD expands automotive-grade FPGAs portfolio

binder adds flange components for the PBC15 connector system

Time to take the plunge

Siemens extends collaboration with TSMC to advance IC and systems design

Semiconductor industry to invest $400bn in 300mm Fab equipment

TSMC and Cadence to deliver advanced-node design flows and 3D-IC solutions

SK hynix begins volume production of 12-Layer HBM3E