Engineering publications brought to you by Mark Allen

Industry Sectors

Infineon QDPAK and DDPAK registered as JEDEC standard for high-power applications

Thermal Interface Gel targets automotive applications

Atos to build Max Planck Society’s new supercomputer

HARMAN and proteanTecs announce remote diagnostics collaboration

GlobalFoundries acquires Renesas' Non-Volatile Resistive RAM technology

ZeroPoint Technologies raises EUR 3.2 million in seed funding

European components distribution sees a record 2022

Farnell to distribute accurate, low-cost particle sensors from Piera Systems

ST reveals scalable, feature-rich automotive high-side gate drivers

Arm posts impressive revenues

Digi-Key Electronics adds 550 new suppliers in 2022

First shipments of reprogrammable photonic microchips