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Delivering and redefining high service distribution

BAE Systems to launch multi-sensor satellite cluster

X-FAB and IHP Leibniz Institute sign SiGe BiCMOS licensing agreement

Navitas unveils GaNSense Half-Bridge Power ICs

Molex introduces solution for co-packaged optics

MEMS market seen growing at 9% CAGR through to 2027

Nexeon awarded funding for silicon materials scale-up

StoreDot starts shipping EV battery cell samples for testing with automotive manufacturers

Omron adds DC relays for automotive and mobility applications

Hirose expands hybrid FPC-to-board connector offering

Magnachip unveils third-generation 200V MV MOSFETs

SK Hynix to invest $11bn in new memory chip plant