Engineering publications brought to you by Mark Allen

New Electronics

Fraunhofer and EU work on 6G communications

Nanoscale magnetic circuit moves data in 3D

Imec expands strategic partnership with Western Digital

Imec and Panasonic develop innovative nanocomposite electrolyte

Unlocking the benefits of digitalisation

Active rectifier controller with reverse protection

Research excellence

Literally, the search is over!

High power thin film chip resistors

Leti demonstrates 300mm wafer-to-wafer direct hybrid bonding with pitch dimension of just 1µm

Molecular magnetism packs power with 'messenger electron'

Project aims to restore vision through cortical stimulation