Engineering publications brought to you by Mark Allen

New Electronics

Cadence and Autodesk collaborate on smart product design

Secure-IC’s Securyzr technology integrated into MediaTek's Dimensity 9300

Evonik to build first plant in North America for ultra-pure colloidal silica

SIGLENT releases new flagship SDS7000A oscilloscope

Toshiba launches first 30V N-Channel Common-Drain MOSFET

Synopsys.ai Copilot to accelerate chip design

UK to offer higher subsidies for offshore windfarms

X-FAB introduces enhanced SPAD devices focused on near-infrared applications

congatec launches ultra-rugged 13th Gen Intel Core modules

Siemens acquires Insight EDA expanding Calibre verification offering

Pickering Interfaces 42-927 PXIe chassis delivers higher signal density, power and cooling

Microchip releases latest TrustAnchor security IC