Engineering publications brought to you by Mark Allen

New Electronics

Arduino introduces the UNO R4

OPENEDGES completes 7nm HBM3 memory subsystem test chip tape-out

SEGGER’s Ozone now available for macOS on the M1/M2

Mouser stocking Nordic Semiconductor's Thingy:53 Platform

TTIA time-series database software available through Direct Insight

Get your entries in now for the 2023 Engineering and Manufacturing awards

DesignSpark continues to evolve

Global fab equipment spending to see strong recovery in 2024 after a weak 2023

Infineon and Delta Electronics to collaborate on electromobility

New MOSFET relays deliver higher dielectric strength and sensitivity

SoftBank and EdgeCortix to deliver low-latency, energy-efficient 5G wireless accelerators

Hirose’s stackable BGA mezzanine connectors look to reduce costs