Engineering publications brought to you by Mark Allen

Power

Spin Transfer Technologies PSC structure positions MRAM as the leading memory for mobile, datacentres and AI

Cadence prototypes first IP interface in silicon for preliminary version of DDR5 standard being developed in JEDEC

TI expands lead among last year’s top analogue suppliers

58VIN, 4A, low EMI, EN55022 B compliant µModule regulator

Power Integrations’ SCALE gate drivers available with conformal coating

PULS 8-port DIN-Rail PoE injectors available

A roadmap for energy storage on board armoured vehicle

Rugged relay designed for harsh inductive loads

Smarter, leaner, tougher. DARWIN is ready for what’s next.

New materials for sustainable, low-cost batteries

Europe’s largest IoT-hardware community launches its first event in Munich

Two weeks to go until PCB Design & Manufacturing Live