IC Packaging Technical Network Event
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The National Microelectronics Institute (NMI) and TWI are organising the fourth in a series of annual one day seminars addressing microelectronics packaging trends, technologies and applications hosted at TWI, Granta Park, Great Abington, Cambridge on Wednesday 22 April 2009.
The 2009 seminar focuses on the Microelectronics Packaging Roadmap and has been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by the International Electronics Manufacturing Initiative (iNEMI) who are headquartered in the USA.
The seminar will include a keynote address from iNEMI to introduce their 2009 Packaging Roadmap and technical presentations addressing both packaging applications and technologies of interest to the UK microelectronics design and manufacturing community in the area of wireless communications, power and automotive electronics.
This Packaging Roadmap seminar provides a unique opportunity for system designers, device designers, packaging and interconnection engineers, technology developers, device and systems applications engineers in the electronics, photonics and sensors industries to gain an overview of UK and global packaging technology requirements, capabilities and trends and to network with colleagues, design and technology providers in this key technology area.