Breaking records again: The largest Embedded World event yet
4 mins read
Embedded World, which takes place in Nuremburg from 1 to 3 March, is enhancing its reputation as the leading event of its kind anywhere in the world. Graham Pitcher reports.
According to the organiser, this year's Embedded World event is likely to be the largest yet. "It is already obvious that embedded world 2011 is heading for a record," said Alexander Mattausch, exhibition director. "Last year has already been topped and the number of exhibiting companies from all over the world will grow considerably again. We assume that we can welcome more than 750 exhibitors in Nuremberg."
The embedded world conference is a major part of the event, sitting alongside the exhibition to create the leading event for the embedded industry.
This year's keynote lecture will be presented by Dr Yrjö Neuvo from the Helsinki University of Technology, who will outline the challenges confronting developers of future embedded systems. He will discuss how constantly increasing networking and interaction between systems will cause the embedded world to expand appreciably.
Key topics of the embedded world conference are: the ARM Cortex architecture; multicore; networking; security; libraries; and Open Source. This year, the conference is focused on major topic blocks, including: Open Source Projects/Embedded Linux; Test and Verification; Networking; Software Development Methods; multicore; reconfigurable Systems; and wireless Technologies.
There is also an embedded displays conference and the event will present a dedicated M2M exhibition area for the third year in a row.
The Embedded Computing business of Emerson Network Power will showcase new boards based on the second generation Intel Core processor family and the latest Intel Atom E6xxx family. Recently announced motherboards and Computer on Modules will be joined by new VME boards and the company's first VPX products for rugged applications. Live demos will address various markets including medical, digital signage and robotics.
Emerson: visit http://www.emersonnetworkpower.com
Hall 9-317
Green Hills will be demonstrating the MULTI integrated development suite, the INTEGRITY real time operating system and INTEGRITY secure visualisation.
The event will see the first public European showing of SuperTrace Probe v3. Starting with 4Gbyte of trace and a sustained Jtag download speed of more than 10Mbyte/s, SuperTrace Probe v3 is tightly integrated with the MULTI TimeMachine debugging suite, allowing developers to fix bugs more quickly. Demonstrations include secure networking, secure virtualisation and asymmetric and symmetric processing.
Green Hills Software: visit http://www.ghs.com
Hall 10-319
Avnet Memec will be introducing the MachXO2 family from Lattice, a range of plds offering a mix of low cost, low power and high system integration. Also on show will be: Silicon Labs' Si10xx low power wireless mcu; the new RL78 ultra low Power mcu family; the introduction of Marvell's quad core ARM Processors; and new PCI Host and Device ics for USB 3.0 connectivity from PLX.
Avnet Memec: visit http://www.avnet-memec.eu
Hall 12-422
Highlights on the Tektronix stand include: a range of oscilloscopes, including the TDS2000C bench oscilloscope, the mid range MSO/DPO5000 and the MSO/DPO4000B series of mixed signal oscilloscopes; the RSA5000 series real time signal analyser; and a range of bench test instruments, including the FCA/MCA3000 series and the PWS4000 dc power supply series. Also on show will be the AWG7000C arbitrary waveform generators and the AFG3000 arbitrary/function generator. Completing the display will be TLA6200 logic analysers.
Tektronix: http://www.tektronix.com
Hall 10-411
Among the products featured on Lattice's stand will be the recently introduced MachXO2 family, which offers a 3X increase in logic density, a 10X increase in embedded memory, more than a 100X reduction in static power and up to 30% lower cost. The LatticeECP3 family will also be featured. This mid range fpga offers the industry's lowest power consumption and price of any serdes capable fpga.
Lattice: visit http://www.latticesemi.com
Hall 9-180
Toshiba will be showcasing its 32bit ARM Cortex-M3 mcus, including the first in the family to feature on chip 12Mbit/s USB-Device connectivity. Suited to applications ranging from industrial control to office automation, TMPM366 devices are supported by hardware and software tools. All new mcus incorporate a 12channel, 12bit a/d converter with a conversion time of 1µs; a 10channel, 16bit timer; and a watchdog timer. A two channel general purpose serial interface allows either uart mode or synchronous mode to be selected, while a single channel uart offers both uart and IrDA 1.0 support.
Toshiba: visit http://www.toshiba-components.com
Hall 12-568
Adlink will exhibit new products based on the latest Intel microarchitectures. The focus includes platforms featuring the second generation Intel Core processor family and the Intel Atom E6xx processor series.
Products featuring the Intel Core i7/i5/i3 processors and Q67/QM67 Express chipsets will be presented, including the Adlink Express, a COM Express module with the new type 6 pinout. Also to be seen is the NuPRO-E340, a PICMG 1.3 System Host Board based on the Intel Core i7/i5/i3 processor and Q67 Express chipset.
Adlink Technology: visit http://www.adlinktech.com
Hall 9-245
Altium will demonstrate Altium Designer 10, which features major advances in pcb development, software design and data management. Amongst the software's features are: Collaborative board design; Design data and release management; Component management; Touch design support; new software installation technology; and support for Windows 7.
Visitors will also see the TASKING VX-toolset for C166 v3.0r1, featuring an improved and more user friendly Eclipse IDE, and the TASKING toolset for TriCore and Cortex-M/R.
Altium: visit http://www.altium.com
Hall 11-228
Embedded computer module developer congatec will be showing its recently introduced COM Express product line, based on the AMD Embedded G-Series platform. This technology expands the COM Express standard with a new architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful cpu and more powerful graphics performance, a good performance per Watt ratio and flexible task allocation on the cpu and gpu. Also on show is the conga-BM67, featuring the Intel Core processors and the Intel QM67 Express chipset.
congatec: visit http://www.congatec.com
Hall 12-122
Silicon Labs will demonstrate embedded mixed signal products, development tools and reference designs designed to streamline the development of touchless human interface, home automation, wireless security, remote keyless entry and energy harvesting applications. Demonstrations include: the 'HID-USB-to-IR' human interface reference design; the QuickSense Studio development environment; wireless mesh networks based on the Si10xx wireless mcu; USB connectivity; the Si4010 rf transmitter SoC; and next generation energy harvesting applications.
Silicon Labs: visit http://www.silabs.com
Hall 12-136
Whether you are looking to design, prototype or deploy embedded devices in automotive, telecoms, industrial, consumer electronics, military or aerospace applications, a visit to the National Instruments stand will be useful. Visitors will see the company's graphical system design platform, which combines the LabVIEW graphical programming environment, the LabVIEW C Code Generator and embedded hardware.
National Instruments: visit http://www.ni.com/uk
Hall 10-221
Embedded developers will be able to see how vfAnalyst can take sequential C code and create optimised, correct by construction multithreaded versions. vfAnalyst shows software engineers promising parallelisation opportunities within C code, easing the development process. The software is said to be suited to engineers tasked with parallelising legacy sequential code, allowing them to complete the project without having to know how the code works.
Vector Fabrics: visit http://www.vectorfabrics.com
Hall 10-552