Engineering publications brought to you by Mark Allen

Features

Test & Measurement

Turning off the shelf components into application specific data acquisition solutions

Manufacturing

Advanced chip manufacturing: Larger wafers, smaller features

Mixed Signal & Analogue

New Electronics Roundtable: More support needed as analogue design gets harder

Power

Thermal management systems feel the heat

Board Level Design

Will AMD's Fusion architecture meet the needs of ETX and XTX based designs?

Test & Measurement

Modular instrumentation set to meet new test challenges

Power

Wireless data to be followed by wireless power?

Research Design

Clear force sensing material set to see touch screen functionality included in larger displays

Test & Measurement

Oscilloscope manufacturers provide more functionality for less

Optoelectronics

As interface speeds increase, will fpgas ‘see the light’ through optical interconnect?

Policy & Business

Directives and standards needed when designing for medical applications

Policy & Business

Fault tolerant designs allow defective chips to be used instead of scrapped