3M, IBM collaborate on electronic adhesive

Using this new class of materials, the companies believe it will be possible to build devices comprising up to 100 separate chips. Such stacking would allow for much higher levels of integration. As an example, the companies suggest processors could be tightly packed with memory and networking elements to create a silicon 'brick' that would be significantly faster than current parts, in turn, enabling more powerful end user products. Bernie Meyerson, IBM's vp of research, said: "Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor – a silicon 'skyscraper.' We believe we can advance the state of art in packaging and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low – key requirements for many manufacturers, especially for makers of tablets and smartphones." Under the agreement, IBM will draw on its expertise in creating semiconductor packaging processes, while 3M will provide its expertise in developing and manufacturing adhesive materials. "Capitalising on our joint know how and industry experience, 3M looks forward to working alongside IBM," said Herve Gindre, division vice president at 3M Electronics Markets Materials Division. "3M has worked with IBM for many years and this brings our relationship to a new level. We are very excited to be an integral part of the movement to build such revolutionary 3d packaging."