Airspan provides mobile operators with wireless solutions for high-reliability public and private urban, suburban and rural applications and offers high-capacity, high-performance solutions that allow operators to deploy rapidly at scale.
Next-generation Airspan solutions will leverage ON Semiconductor’s QCS-AX Wi-Fi 6 family of chipsets. These products are intended to maximise the benefits of the new standard including the additional spectrum in the 6 GHz band. The OFDMA-based 8x8 beamforming technology will significantly improve noise immunity, while enabling high-spectral efficiency and delivering multi-gigabit capacities, benefiting from the 160 MHz channels with modulation rates of 1024 QAM.
According to Airspan, it will use the technology to augment the reliability and scalability for Outdoor and FWA deployments using the ON's Wi-Fi 6 solutions. Next generation Airspan products currently under development will address market demand for high spectral efficiency, interference immunity, and network orchestration capabilities for seamless carrier-grade deployments.
“The FWA innovation has expanded Wi-Fi use case into outdoor space. By leveraging Wi-Fi 6 to offload LTE/5G networks, end consumers can expect fast and seamless connectivity. We are pleased to continue working with Airspan to bring new connectivity to underserved markets,” said Irvind Ghai, VP Marketing, Quantenna Connectivity Solutions at ON Semiconductor.
