“As the electronics industry pushes the boundaries of complexity and miniaturisation, engineers have struggled with simulations that often compromise on detail for expediency. Altair SimSolid will empower engineers to capture the intricate complexities of PCBs and ICs without simplification,” said James R. Scapa, founder and chief executive officer, Altair.
“Traditional simulation methods often require approximations when analysing PCB structures due to their complexity. Altair SimSolid eliminates these approximations to run more accurate simulations for complex problems with vast dimensional disparities.”
Altair SimSolid has, according to Altair, the ability to accurately predict complex structural problems at speed while eliminating the complexity associated with extended hours of modelling. It is able to eliminate geometry simplification and meshing, two of the most time-consuming and expertise-intensive tasks done in traditional finite element analysis.
As a result, it is up to 25x faster than traditional finite element solvers and can handle extremely complex assemblies.
Having experienced fast adoption in the aerospace and automotive industries, two sectors that typically experience challenges associated with massive structures, Altair SimSolid is now set to play a significant role in the electronics market.
The initial release, expected in Q2 2024, will support structural and thermal analysis for PCBs and ICs with full electromagnetics analysis coming in a future release.
The simulation market is increasingly looking to leverage AI technology to develop physics-informed neural networks. Altair SimSolid’s ability to rapidly and accurately model and simulate complex electronics systems means that it is set to have an important role in terms of training large use cases quickly and economically.
The journey from electronic computer-aided design (ECAD) to simulation has historically been strewn with the obstacles of mesh generation – a necessary but time-intensive step that delays insights and stretches project timelines.
Altair SimSolid’s meshless technology will tackle intricate challenges like signal integrity (SI), power integrity (PI), and electromagnetic compatibility/interference (EMC/EMI), all while making electromagnetic simulations more accessible and efficient.
The solution’s ECAD to simulation workflow will enable users to seamlessly scale from meters to nanometres, ensuring every detail is rendered accurately. This translates to faster time to results and the ability to solve even more complex electromagnetic problems, empowering engineers to achieve improved design outcomes.
With the intention that Altair SimSolid will advance towards the inclusion of full-wave electromagnetics, Altair said that it demonstrated the company’s vision of providing a comprehensive, multi-disciplinary simulation environment.
It said that its aim was not only to set a new standard against traditional, mesh-reliant systems but to promise a future where thermal, structural, and electromagnetic challenges are addressed within a unified, meshless platform for rapid and precise design iterations.
