Board design package upgraded

The CR-8000 suite is said by the company to be the only concept to manufacturing multiboard package developed from the start to address the requirements of system level design optimisation. "In the process of researching CR-8000, we found that system design cannot only be single board design, as in the past," said Gerhard Lipski, general manager, Zuken Europe and Americas. "It had to handle multiboard design throughout the flow. But we realised that, to do it right, we had to start again. This not only optimises our solution for today, but also gives us the ability to keep up with future advances more easily." The integrated design flow features four modules – System Planner; Design Gateway; Design Force; and DFM Center – which are said to cover initial system planning, detailed schematic and pcb design; and optimised manufacturing output. The Design Force module supports single board, multiboard and chip package board interconnect optimisation in native 3D. Featuring embedded interactive and automatic routing, design analysis and constraint management, the module allows design teams to layout complete system designs – from prototypes to complex systems – using one tool.