Built upon Allegro and OrCAD core technology, the Allegro X platform is set to revolutionise and streamline the system design process for engineers, according to Cadence, by offering much greater collaboration across all engineering disciplines, integration with best-in-class Cadence signoff-level simulation and analysis products, and greater layout performance.
With engineers having to design and collaborate across multiple domains, including electromagnetic (EM), thermal, signal and power integrity (SI/PI), and logical/physical implementation, the Allegro X platform looks to simplify user interaction and deliver quicker technology access and immediate value for all level of users.
By minimising iterations and providing access to both the logical and physical domains simultaneously with concurrent collaboration capabilities across schematic, layout and analysis activities, the Allegro X platform is able to reduce the time and effort to complete the design of complex systems by up to 4X compared to legacy design tools.
The Allegro X platform leverages a hybrid cloud solution that provides scalable compute resources and full technology access while reducing deployment footprints and complexity. With the Allegro X platform, engineers will be able to deliver high er quality designs with access to the Cadence Clarity 3D Solver, Celsius Thermal Solver, Sigrity technology and PSpice for simulation and analysis, Allegro Pulse for design data management, and interoperability with the AWR Microwave Office RF design flow.
By leveraging GPU technology in combination with core architectural optimisation, the Allegro X's performance has been accelerated across a wide range of operations. In addition, the platform utilises cloud resources to synthesize full or partial PCB designs.
Innovative machine learning (ML) techniques concurrently optimise the design for manufacturing, SI and PI requirements while designing the power delivery network (PDN), device placement and signal interconnect as specified by the system architect/electrical engineer.
“The Allegro X platform establishes a unified engineering platform, boosting overall design team productivity up to 4X. Engineers now have a framework for logical and physical design, in 2D or 3D, single- or multi-board, that allows them to optimise resources even on the most complex 5G designs, enabled by interoperability with the AWR Microwave Office RF design flow,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “Cadence R&D has been working diligently with academia and industry partners on groundbreaking, analysis-driven PCB synthesis that significantly enhances design productivity.”
