Centre dedicated to 3D packaging technologies is first of its kind

The centre is the first dedicated facility of its kind focused on developing next generation 3D packaging technologies to feed the growth of mobile devices. 3D chip packaging is expected to be a major inflection point for the semiconductor industry, allowing smaller packages, lower power consumption and higher data bandwidth. With 3D chip packaging, multiple chips can be stacked on top of each other and connected with wiring that runs vertically through the stack – through silicon vias. When used to stack memory chips on logic chips, this technology is expected to reduce package size by 35%, decrease power consumption by 50%, and increase data bandwidth by a factor of eight or more times. Sited in Singapore's Science Park II, the centre has been built with a combined investment of more than $100million from the two organisations. According to both companies, the centre will be the most advanced lab of its kind dedicated to wafer level packaging and will combine Applied Materials' equipment and process technology with IME's research capability in 3D chip packaging. The centre has been established in a bid to position Singapore as a global leader in semiconductor R&D and to help accelerate the development of 3D packaging technology globally. The facility features a 14,000ft² Class-10 cleanroom and is equipped with a fully integrated line of 300mm manufacturing systems to support the research and development of 3D chip packaging. The centre has also been conceived to allow both parties to pursue independent research initiatives including process engineering, integration and hardware development. Research activities are already underway with a team of more than 50 personnel. "Today, we are not only opening the most advanced wafer level packaging lab of its kind in the world, but we are also opening a new product development capability for Applied Materials in Asia," said Mike Splinter, chairman and chief executive officer of Applied Materials. "This Centre will strengthen our ability to advance new technologies and allow us to work more closely with our customers in Asia." Lim Chuan Poh, chairman of A*STAR, added: "The combined efforts ... [reaffirm] our strategy of leveraging a suite of capabilities to form meaningful and impactful public private research alliances which catalyse the growth of private sector R&D activities in Singapore. This will create many high value jobs locally and help to further anchor Singapore's semiconductor manufacturing base." Professor Dim-Lee Kwong, executive director of IME, concluded: "The Centre of Excellence is a prime example of a strategic relationship fostered between two leading players in the global semiconductor value chain and will spur the development of innovative wafer level packaging technologies to be implemented globally. This collaboration will enable the semiconductor industry to accelerate the adoption of 3D chip packaging."