Collaboration aims to develop sub micron gold particle transfer technology

By implementing the bonding technology in packaging and assembly processes, Japanese firm Tanaka says manufacturers of micro electro mechanical systems (MEMS) devices, led chips and small electronic components will be able to form fine patterns on silicon wafers for sealing frames and electrodes in real time without any waste and with a 100% usage rate. This is expected to considerably lower the cost of key processes. Tanaka will be responsible for developing the manufacturing processes of the substrate for the pattern transferring of the sub micron gold particles. It claims the technique will enable the particles to have a higher heat resistance and lower stress than existing joints and be able to be bonded at lower temperatures due to their small size. SUSS MicroTec, which sells wafer bonding devices globally, will develop the wafer level transfer and bonding equipment using transfer substrates. The two companies aim to begin production of the technology in Q1 2012.