The combined strengths of InP and Silicon-on-Insulator (SOI) technologies will enable multi-tera bit data rates for datacom and telecom applications.
Through the co-optimisation of SOI, InP, and Micro-Transfer-Printing (MTP) technologies, the new platform is intended to address customer requirements for high-speed data rates and energy efficiency in high-volume manufacturing of optical transceivers.
The platform also enables new functionalities and improved system performance while reducing integration costs through relaxed photonics packaging requirements.
MTP technology, pioneered by X-Celeprint, provides a broad degree of freedom for the system and product designers, by allowing flexible integration of chiplets into the product design.
The collaboration has made significant progress, resulting in the development of a design flow and PDK that enables the design of photonics circuits integrating InP chiplets on an SOI platform.
This design flow is implemented in Luceda's IPKISS EDA tool and the company’s technical expertise and support has enabled the design of the demonstrator. As part of this development, Epiphany Design – an X-FAB innovation and XCHAIN partner – has successfully demonstrated the new heterogeneous InP-on-SOI design flow with an optical transceiver demonstrator.
Commenting Jörn Epping, CEO of Epiphany Design, said, “By bringing together the integration density of silicon with the high performance of InP actives, we enable new possibilities for disruptive innovation in telecom, datacom, and beyond. This approach empowers PIC designers with greater flexibility and a clear path towards scalable, high-performance PIC-based solutions.”
This collaboration builds upon the PhotonixFAB EU funding project, which supports the development of industrial pilot lines for silicon photonics SOI, micro-transfer print ready InP chiplets and MTP of InP chiplets on SOI and SiN photonics wafers.
The complete design flow will be available for early access in the first quarter of 2026.
The goal is to support lead customers industrial prototyping by mid-2026, with production ramp-up readiness in 2027.
