Committee to develop COM Express module plug and play spec
Adlink Technology, congatec and MSC have formed a PICMG COM Express plug and play subcommittee. The effort aims to increase the use of COM Express modules by defining a set of carrier design guidelines that enable plug and play support and which increase compatibility between COM Express modules from various vendors.
Jeff Munch, Adlink’s cto, will act as interim chairman of the subcommittee and expects the carrier board design specification to be released in February 2008.
The basis of this subcommittee began in April 2007, when Aaeon, Adlink, Ampro and congatec started the COM Express PnP Initiative, focused on carrier board design. This initiative has evolved to address incompatibilities between different proprietary carrier board designs by providing a definite specification to increase and streamline the adoption and use of COM Express products.
