Design teams are encouraged to propose design concepts that combine MEMS and mixed-signal technologies. The organisers will provide free training workshops to familiarise the participating teams with the design tools, design methodologies and process technologies involved.
A panel of industry professionals and academics will undertake appraisal of the submissions. Each submission will be judged on the degree of innovation demonstrated in hardware and methodology, the novelty of the application and the value the design provides. Awards for the top three submissions will be presented at Cadence’s annual user conference, CDNLive EMEA 2018, in Munich and the winning team’s solution will be manufactured at X-FAB’s wafer production facilities.
“Supporting innovation and advancement in electronic design is fundamental to what this contest is all about,” said Alexander Duesener, corporate VP EMEA of Cadence Design Systems. “Creating mixed-signal logic and MEMS designs requires a new process flow and totally new thinking. By enabling the winning design team to turn their concepts into manufactured designs, we highlight the value of MEMS and mixed-signal designs in today’s products.”