Europe in good position to compete in silicon photonics
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According to French research organisation CEA-Leti, the recently concluded HELIOS programme – an €8.5million European Commission project – has put Europe in a strong positioned to design and manufacture volume silicon photonics devices.
One of the outcomes of the project was the development of a complete design and fabrication supply chain for integrating a photonic layer with a cmos circuit, using microelectronics fabrication processes.
"It is strategically important for Europe to maintain photonic chip design and chip integrating functions to compete with other countries and to encourage innovation by European microelectronics companies," said Leti's ceo Laurent Malier. "HELIOS' success in creating the essential building blocks for integrating photonics with cmos circuits and making the process available to a variety of users underscores the key role that broad European technological cooperation plays in a very competitive global business environment."
Launched by the EC in 2008 and coordinated by CEA-Leti, HELIOS focused on developing efficient optical sources, integrated lasers, high speed modulators and photodetectors. The project, which had 20 members, also combined and packaged these blocks to demonstrate complex functions.