"This significant first round of financing validates our efforts over the past five years with Leti and Soitec to commercialise GaN-on-silicon technology and supports our commitment to provide customers with qualified GaN devices in large volumes," said Frédéric Dupont, Exagan's CEO. "We are focused on offering our customers reliable, high-performance devices that are developed with industrial partners already sourcing technologies or products for the targeted markets."
The financing round follows Exagan's recent agreement with foundry X-FABto produce devices on 200mm wafers targeted at markets such as solar, automotive and IT electronics. It also has a strategic partnership with CEA-Leti, which is using Exagan's 650V G-FET platform to develop applications with its industrial partners.
Soitec CEO Paul Boudre noted: "Soitec is obviously excited about this successful round of financing. Its GaN-on-silicon technology, which leverages our materials expertise, opens interesting opportunities in promising markets such as electronics, automotive and energy.
